1. 2. 3. material content data sheet sales product name its42008-sb-d issued 29. august 2013 ma# MA001122786 package pg-dso-36-26 weight* 2046.36 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 16.733 0.82 0.82 8177 8177 leadframe inorganic material phosphorus 7723-14-0 0.383 0.02 187 non noble metal zinc 7440-66-6 1.533 0.07 749 non noble metal iron 7439-89-6 30.652 1.50 14979 non noble metal copper 7440-50-8 1244.598 60.82 62.41 608201 624116 wire noble metal gold 7440-57-5 4.281 0.21 0.21 2092 2092 encapsulation organic material carbon black 1333-86-4 1.443 0.07 705 plastics epoxy resin - 66.356 3.24 32426 inorganic material silicondioxide 60676-86-0 653.457 31.93 35.24 319326 352457 leadfinish non noble metal tin 7440-31-5 16.150 0.79 0.79 7892 7892 plating noble metal silver 7440-22-4 0.741 0.04 0.04 362 362 solder noble metal silver 7440-22-4 0.151 0.01 74 non noble metal tin 7440-31-5 0.100 0.00 49 non noble metal lead 7439-92-1 9.784 0.48 0.49 4781 4904 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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